Description
PERC Solar Cell Detailed Specifications |
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Overview |
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— PERC is a mature and widely used technology in monocrystalline silicon solar cells. It improves on standard cells by adding rear-surface passivation and better light trapping. |
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— Key features include a rear passivation layer (often dielectric), local back surface field (LBSF), anti-reflection coatings, finer metallization, and multi-busbar designs to reduce resistive losses. |
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— It balances relatively high efficiency with cost-effectiveness. |
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Efficiency Records & Typical Performance |
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Parameter |
Value / Example |
Record Efficiency |
~ 24.5 % achieved by Trina Solar for 210 mm × 210 mm P-type mono-PERC cell. |
Industrial Batch Efficiencies |
~ 23.5-24.0 % for large-area PERC cells in mass production (210 mm) by Trina and others. |
Efficiency under Standard Equipment / Bifacial Variation |
23.39 % for a PERC cell manufactured with standard equipment, bifacial variant, 9 busbars, area ~ 252 cm². |
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Key Technical Characteristics |
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Spec |
Typical / Example Value |
Wafer Size |
210 mm × 210 mm (some large-area cells. |
Cell Type |
P-type monocrystalline silicon, PERC structure with rear passivation, advanced AR coatings, super multi-busbar (MBB) designs. |
Metallization |
Ultra-fine metallization fingers, multiple busbars to reduce series resistance. |
Anti-Reflection Coating (ARC) |
Multi-layer AR coatings used to reduce front-surface reflection, improving light trapping. |
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Temperature Behavior & Degradation |
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— Temperature Coefficient (Pmax): Expected negative coefficient, usually somewhat worse than TOPCon/HJT but acceptable in many climates (often around -0.30 to -0.38 %/°C for P-type PERC large-area cells) based on historical trends. |
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— Light Induced Degradation (LID): PERC cells (especially P-type) suffer more LID due to boron–oxygen defects. Many manufacturers take steps to mitigate this via material purity, optimized passivation, pre-conditioning |
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Trade-offs and Limitations |
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— Efficiency improvements are becoming incremental: recent advances are greater for TOPCon, HJT in many cases. PERC is getting closer to its practical limits in large-area industrial manufacture. |
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— Degradation (LID / potential-induced degradation) is still an issue for P-type PERC cells, though mitigations improve the lifetime. |
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— Temperature performance: less favorable than some newer technologies (HJT, TOPCon) in very high-heat operating environments. |
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— Rear-side reflection and bifacial gains are possible only if the PERC cell design is adapted (grid pattern or transparent back contact) — standard PERC cells often only produce from front side. |
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Product Characteristics |
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Dimensions |
156.75×156.75 mm 158.75×158.75 mm 166×166 mm 182×182 mm 182×183.75 mm 210×210 mm |
Maximum Power (Pmax) |
2.52 W – 10.364 W |
Cell Thickness |
180 ± 18 µm, 160 ± 20 µm |
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Front Surface (-) |
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No. of Busbars |
2,3,4,5,9,10,11,12 |
Busbar Width |
0.8 mm – 0.04±0.02 mm |
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Back Surface |
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No. of Soldering Pads |
2,3,4,5,9,10,11,12 |
Soldering Pad Width |
1.6 mm, 1.8±0.3 mm, 0.6±0.1 mm |
Soldering Pad Material |
Silver – Aluminum |
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Electrical Data at STC |
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Cell Efficiency (Maximum) |
23.50% |
Voltage at Maximum Power Point (Vmpp) |
0.561 V – 0.6 V |
Current at Maximum Power Point (Impp) |
4.486 A – 17.273 A |
Open Circuit Voltage (Voc) |
0.66 V – 0.6983 V |
Short Circuit Current (Isc) |
4.772 A – 18.052 A |
Fill Factor (FF) |
79.9 % – 82.22 % |
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Thermal Ratings |
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Temperature Coefficient of Pmax |
(-0.38 %/˚C), ( -0.44 %/˚C) |
Temperature Coefficient of Voc |
(-0.36 %/˚C), (-0.32 %/˚C) |
Temperature Coefficient of Isc |
(0.07 %/˚C), (0.36 %/˚C) |
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Examples of specifications for some types of PERC Solar Cells |
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M166 9BB Mono PERC Cell |
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Product Characteristics |
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Model No. |
6.11 |
6.17 |
6.22 |
6.28 |
6.33 |
6.39 |
Product Characteristics |
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Cell Technology |
PERC |
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Dimensions |
166×166 mm |
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Cell Thickness |
170 ± 20 µm |
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Front Surface (-) |
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No. of Busbars |
9 |
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Busbar Width |
0.1±0.03 mm |
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Busbar Material |
Silver |
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Anti Reflection Coating |
Silicon nitride |
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Back Surface (+) |
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No. of Soldering Pads |
9 |
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Soldering Pad Width |
1.3±0.25 mm |
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Soldering Pad Material |
Silver |
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Back Surface Field (BSF) |
Aluminium |
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Electrical Data at STC |
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Maximum Power (Pmax) |
6.11 W |
6.17 W |
6.22 W |
6.28 W |
6.33 W |
6.39 W |
Voltage at Maximum Power Point (Vmpp) |
0.5779 V |
0.5811 V |
0.5843 V |
0.5871 V |
0.5901 V |
0.5927 V |
Current at Maximum Power Point (Impp) |
10.579 A |
10.615 A |
10.65 A |
10.69 A |
10.727 A |
10.799 A |
Open Circuit Voltage (Voc) |
0.6811 V |
0.6835 V |
0.6856 V |
0.6881 V |
0.6905 V |
0.6929 V |
Short Circuit Current (Isc) |
11.128 A |
11.158 A |
11.187 A |
11.216 A |
11.246 A |
11.284 A |
Cell Efficiency |
22.3 % |
22.5 % |
22.7 % |
22.9 % |
23.1 % |
23.3 % |
Fill Factor (FF) |
80.66 % |
80.88 % |
81.13 % |
81.32 % |
81.52 % |
81.86 % |
Thermal Ratings |
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Temperature Coefficient of Pmax |
-0.38 %/˚C |
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Temperature Coefficient of Voc |
-0.36 %/˚C |
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Temperature Coefficient of Isc |
0.07 %/˚C |
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SR-10B182MPERC-B |
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Product Characteristics |
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Model No. |
7.36 |
740 |
7.43 |
7.46 |
7.49 |
7.53 |
Product Characteristics |
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Cell Technology |
PERC |
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Dimensions |
182×182 mm |
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Diagonal |
245±0.25 mm |
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Cell Thickness |
160 ± 16 µm |
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Front Surface (-) |
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No. of Busbars |
10 |
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Busbar Width |
0.06±0.03 mm |
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Anti Reflection |
Silicon nitride |
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Electrical Data at STC |
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Maximum Power (Pmax) |
7.36 W |
7.4 W |
7.43 W |
7.46 W |
7.49 W |
7.53 W |
Voltage at Maximum Power Point (Vmpp) |
0.581 V |
0.583 V |
0.585 V |
0.587 V |
0.589 V |
0.591 V |
Current at Maximum Power Point (Impp) |
12.668 A |
12.693 A |
12.701 A |
12.709 A |
12.718 A |
12.743 A |
Open Circuit Voltage (Voc) |
0.676 V |
0.677 V |
0.678 V |
0.679 V |
0.68 V |
0.681 V |
Short Circuit Current (Isc) |
13.491 A |
13.508 A |
13.516 A |
13.529 A |
13.539 A |
13.549 A |
Cell Efficiency |
22.30-22.40 % |
22.40-22.50 % |
22.50-22.60 % |
22.60-22.70 % |
22.70-22.80 % |
22.80-22.90 % |
Fill Factor (FF) |
80.71 % |
80.92 % |
81.08 % |
81.21 % |
81.36 % |
81.61 % |
Thermal Ratings |
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Temperature Coefficient of Pmax |
-0.36 %/˚C |
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Temperature Coefficient of Voc |
-0.36 %/˚C |
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Temperature Coefficient of Isc |
0.04 %/˚C |
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PERC M182 10BB |
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Product Characteristics |
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Model No. |
PERC M182 10BB |
EvoCell-182B |
Product Characteristics |
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Cell Technology |
PERC |
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Dimensions |
182×182 mm |
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Diagonal |
247±0.5 mm |
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Cell Thickness |
175/180 ± 20 µm |
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Front Surface (-) |
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No. of Busbars |
10 |
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Busbar Width |
1.2±0.3 mm |
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Busbar Material |
Aluminium |
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Anti Reflection Coating |
Silicon nitride |
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Back Surface (+) |
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No. of Soldering Pads |
10 |
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Soldering Pad Width |
1.2±0.3 mm |
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Soldering Pad Material |
Aluminium |
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Back Surface Field (BSF) |
Aluminium |
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Electrical Data at STC |
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Maximum Power (Pmax) |
7.69 W |
7.76 W |
Voltage at Maximum Power Point (Vmpp) |
0.613 V |
0.593 V |
Current at Maximum Power Point (Impp) |
12.539 A |
13.086 A |
Open Circuit Voltage (Voc) |
0.69 V |
0.692 V |
Short Circuit Current (Isc) |
13.583 A |
13.776 A |
Cell Efficiency |
22.3-23.3 % |
22.1-23.5 % |
Fill Factor (FF) |
82.01 % |
81.4 % |
Thermal Ratings |
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Temperature Coefficient of Pmax |
-0.39 %/˚C |
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Temperature Coefficient of Voc |
-0.3 %/˚C |
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Temperature Coefficient of Isc |
0.06 %/˚C |
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G1-PERC Cell |
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Product Characteristics |
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Model No. |
5.42 |
5.44 |
5.47 |
5.49 |
5.52 |
5.54 |
5.57 |
5.59 |
Product Characteristics |
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Cell Technology |
PERC |
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Dimensions |
158.75×158.75 mm |
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Cell Thickness |
160 ± 20 µm |
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Front Surface (-) |
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No. of Busbars |
5 |
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Back Surface (+) |
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No. of Soldering Pads |
5 |
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Soldering Pad Width |
1.6±0.05 mm |
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Electrical Data at STC |
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Maximum Power (Pmax) |
5.42 W |
5.44 W |
5.47 W |
5.49 W |
5.52 W |
5.54 W |
5.57 W |
5.59 W |
Voltage at Maximum Power Point (Vmpp) |
0.565 V |
0.566 V |
0.568 V |
0.569 V |
0.571 V |
0.573 V |
0.575 V |
0.577 V |
Current at Maximum Power Point (Impp) |
9.59 A |
9.61 A |
9.63 A |
9.65 A |
9.67 A |
9.67 A |
9.69 A |
9.69 A |
Open Circuit Voltage (Voc) |
0.67 V |
0.671 V |
0.672 V |
0.673 V |
0.674 V |
0.675 V |
0.676 V |
0.677 V |
Short Circuit Current (Isc) |
10.14 A |
10.14 A |
10.16 A |
10.17 A |
10.18 A |
10.18 A |
10.19 A |
10.19 A |
Cell Efficiency |
21.5 % |
21.6 % |
21.7 % |
21.8 % |
21.9 % |
22 % |
22.1 % |
22.2 % |
Fill Factor (FF) |
79.75 % |
79.94 % |
80.11 % |
80.22 % |
80.47 % |
80.64 % |
80.89 % |
81.05 % |
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166M-9BB |
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Product Characteristics |
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Model No. |
5.89 |
5.92 |
5.95 |
5.98 |
6 |
6.03 |
6.06 |
6.09 |
6.11 |
Product Characteristics |
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Cell Technology |
PERC |
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Dimensions |
166×166 mm |
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Cell Thickness |
190 ± 30 µm |
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Front Surface (-) |
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No. of Busbars |
9 |
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Busbar Width |
0.1±0.03 mm |
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Busbar Material |
Silver |
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Anti Reflection Coating |
Silicon nitride |
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Back Surface (+) |
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No. of Soldering Pads |
9 |
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Soldering Pad Width |
1.3±0.25 mm |
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Soldering Pad Material |
Silver |
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Back Surface Field (BSF) |
Aluminium |
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Electrical Data at STC |
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Maximum Power (Pmax) |
5.89 W |
5.92 W |
5.95 W |
5.98 W |
6 W |
6.03 W |
6.06 W |
6.09 W |
6.11 W |
Voltage at Maximum Power Point (Vmpp) |
0.5684 V |
0.5701 V |
0.572 V |
0.5742 V |
0.576 V |
0.5781 V |
0.5799 V |
0.5817 V |
0.5835 V |
Current at Maximum Power Point (Impp) |
10.371 A |
10.386 A |
10.401 A |
10.409 A |
10.424 A |
10.433 A |
10.448 A |
10.462 A |
10.477 A |
Open Circuit Voltage (Voc) |
0.6713 V |
0.6719 V |
0.6729 V |
0.6743 V |
0.6748 V |
0.6774 V |
0.6777 V |
0.678 V |
0.679 V |
Short Circuit Current (Isc) |
10.958 A |
10.974 A |
10.99 A |
10.996 A |
11.014 A |
11.021 A |
11.039 A |
11.046 A |
11.06 A |
Cell Efficiency |
21.5 % |
21.6 % |
21.7 % |
21.8 % |
21.9 % |
22 % |
22.1 % |
22.2 % |
22.3 % |
Fill Factor (FF) |
80.12 % |
80.3 % |
80.45 % |
80.6 % |
80.79 % |
80.81 % |
80.98 % |
81.26 % |
81.41 % |
Thermal Ratings |
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Temperature Coefficient of Pmax |
-0.38 %/˚C |
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Temperature Coefficient of Voc |
-0.36 %/˚C |
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Temperature Coefficient of Isc |
0.07 %/˚C |
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Mono PERC Bifacial – Acidic Rear Side Polishing |
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Product Characteristics |
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Model No. |
22.00L7.36W |
22.10L7.40W |
22.20L7.43W |
22.30L7.46W |
22.40L7.50W |
22.50L7.53W |
22.60L7.56W |
22.70L7.60W |
Product Characteristics |
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Cell Technology |
PERC |
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Dimensions |
182×183.75 mm |
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Diagonal |
256±0.5 mm |
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Cell Thickness |
166 ± 16 µm |
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Front Surface (-) |
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No. of Busbars |
9 |
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Busbar Width |
0.10±0.05 mm |
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Busbar Material |
Silver |
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Anti Reflection Coating |
Silicon nitride |
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Back Surface (+) |
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No. of Soldering Pads |
12 |
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Soldering Pad Material |
Silver |
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Back Surface Field (BSF) |
Aluminium |
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Electrical Data at STC |
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Maximum Power (Pmax) |
7.36 W |
7.4 W |
7.43 W |
7.46 W |
7.5 W |
7.53 W |
7.56 W |
7.6 W |
Voltage at Maximum Power Point (Vmpp) |
0.572 V |
0.574 V |
0.576 V |
0.578 V |
0.58 V |
0.582 V |
0.583 V |
0.585 V |
Current at Maximum Power Point (Impp) |
12.871 A |
12.888 A |
12.898 A |
12.908 A |
12.925 A |
12.939 A |
12.959 A |
12.986 A |
Open Circuit Voltage (Voc) |
0.671 V |
0.672 V |
0.674 V |
0.675 V |
0.676 V |
0.677 V |
0.678 V |
0.68 V |
Short Circuit Current (Isc) |
13.605 A |
13.647 A |
13.652 A |
13.672 A |
13.693 A |
13.7 A |
13.716 A |
13.741 A |
Cell Efficiency |
22-22.1 % |
22.1-22.2 % |
22.2-22.3 % |
22.3-22.4 % |
22.4-22.5 % |
22.5-22.6 % |
22.6-22.7 % |
22.7-22.8 % |
Fill Factor (FF) |
80.65 % |
80.67 % |
80.74 % |
80.84 % |
80.99 % |
81.19 % |
81.24 % |
81.3 % |
Thermal Ratings |
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Temperature Coefficient of Pmax |
-0.32 %/˚C |
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Temperature Coefficient of Voc |
-0.259 %/˚C |
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Temperature Coefficient of Isc |
0.041 %/˚C |