TOPCon Solar Cell Detailed Specifications

Cell Type / Structure

N-type silicon wafer with ultra-thin tunnel oxide (~1-2 nm) + phosphorus-doped polysilicon rear layer for minimized carrier recombination and enhanced Voc.

Efficiency

Commercial cell efficiency ranges between 24.5% and 25.5%. Advanced R&D; cells are expected to reach 26-28% efficiency.

Dimensions & Thickness

Typical cell size: 182 × 182 mm; wafer thickness around 130-150 µm ± tolerance.

Electrical Characteristics

Voc often >700 mV. Isc ≈ 13.5–13.8 A for 182 mm cells under STC. Fill Factor typically 82–84%.

Temperature Coefficients

Low-Light & High-Temperature Performance

Excellent low-light response, maintaining >97% relative efficiency at 200 W/m². Lower thermal degradation compared to PERC

Degradation & Lifetime

Year-1 degradation ≤ 1%. After 25–30 years, ≥ 87–90% of initial power output remains. Free of Boron-Oxygen related degradation.

Bifaciality & Advanced Properties

Bifaciality factor can reach >80–85%. NOCT typically ~42 ± 2°C. Supports system voltages up to 1500V

Manufacturing Considerations

Requires precise control of tunnel oxide and polysilicon deposition. Slightly higher silver paste consumption vs. PERC

Product Characteristics

Dimensions

182×210 mm

210×210 mm

Maximum Power (Pmax)

0.36 W – 11.03 W

Cell Thickness

130 ± 15 µm – 130 ± 20 µm

140 ± 14 µm – 150 ± 30 µm

Front Surface (-)

No. of Busbars

2,5,10,12

Busbar Width

0.03±0.015 mm – 1.2 mm – 0.036±0.02 mm

Back Surface

No. of Soldering Pads

2,5,10,12

Soldering Pad Width

0.036±0.02 mm – 0.03±0.015 mm -1.6 mm

Soldering Pad Material

 Silver – Aluminum

Electrical Data at STC

Cell Efficiency (Maximum)

23% – 25%

Voltage at Maximum Power Point (Vmpp)

0.583 V – 0.627 V

Current at Maximum Power Point (Impp)

15.3306 A – 17.601 A

Short Circuit Current (Isc)

15.952 A – 18.332 A

Fill Factor (FF)

83.15 % – 88.05 %

Thermal Ratings

Temperature Coefficient of Pmax

(-0.29 %/˚C) – (-0.32 %/˚C)

Temperature Coefficient of Voc

(-0.25 %/˚C)- (-0.3 %/˚C)

Temperature Coefficient of Isc

0.045 %/˚C – 0.04 %/˚C

Examples of specifications for some types of TOPCon Solar Cells

AL-TOPCON-M10 16BB & AL-TOPCON-M10 10BB

Product Characteristics

Model No.

7.76

7.79

7.83

7.86

7.89

7.92

7.96

7.99

Product Characteristics

Cell Technology

TOPCon

Dimensions

182×182 mm

Diagonal

247±0.25 mm

Cell Thickness

150 ± 30 µm

Front Surface (-)

No. of Busbars

10

Busbar Width

0.036±0.02 mm

Anti Reflection Coating

Silicon nitride

Back Surface (+)

No. of Soldering Pads

10

Soldering Pad Width

0.036±0.02 mm

Electrical Data at STC

Maximum Power (Pmax)

7.76 W

7.79 W

7.8 W

7.86 W

7.89 W

7.92 W

7.96 W

7.99 W

Voltage at Maximum Power Point (Vmpp)

0.602 V

0.604 V

0.607 V

0.61 V

0.61 V

0.613 V

0.614 V

0.617 V

Current at Maximum Power Point (Impp)

12.896 A

12.897 A

12.89 A

12.891 A

12.93 A

12.921 A

12.954 A

12.948 A

Open Circuit Voltage (Voc)

0.708 V

0.71 V

0.712 V

0.713 V

0.714 V

0.715 V

0.714 V

0.717 V

Short Circuit Current (Isc)

13.695 A

13.675 A

13.663 A

13.655 A

13.646 A

13.638 A

13.643 A

13.639 A

Cell Efficiency

23.5 %

23.6 %

23.7 %

23.8 %

23.9 %

24 %

24.1 %

24.2 %

Fill Factor (FF)

80.37 %

80.31 %

80.49 %

80.78 %

81.04 %

81.26 %

81.64 %

81.63 %

Thermal Ratings

Temperature Coefficient of Pmax

-0.32 %/˚C

Temperature Coefficient of Voc

-0.25 %/˚C

Temperature Coefficient of Isc

0.045 %/˚C

TOPCon 182 16BB & TOPCon 210 18BB

Product Characteristics

Model No.

TOPCon 182 16BB

TOPCon 210 18BB

Product Characteristics

Cell Technology

TOPCon

Dimensions

182×182 mm

210×210 mm

Diagonal

247.28±0.5 mm

295±0.05 mm

Cell Thickness

130 ± 13 µm

150 ± 20 µm

Front Surface (-)

Busbar Width

0.036±0.02 mm

0.045±0.02 mm

Busbar Material

Silver

Anti Reflection Coating

Silicon nitride

Back Surface (+)

No. of Soldering Pads

0.036±0.02 mm

0.045±0.02 mm

Soldering Pad Material

Silver

Back Surface Field (BSF)

Aluminium

Electrical Data at STC

Maximum Power (Pmax)

8.42 W

10.938 W

Voltage at Maximum Power Point (Vmpp)

0.6168 V

0.625 V

Current at Maximum Power Point (Impp)

13.651 A

17.505 A

Open Circuit Voltage (Voc)

0.7178 V

0.72 V

Short Circuit Current (Isc)

14.218 A

18.367 A

Cell Efficiency

22.8-25.5 %

22.9-24.8 %

Fill Factor (FF)

82.5 %

82.73 %

M182-16BB

Product Characteristics

Model No.

7.794

7.825

7.861

7.894

7.925

7.958

7.991

8.024

Product Characteristics

Cell Technology

TOPCon

Dimensions

182×182 mm

Cell Thickness

140 ± 14 µm

Front Surface (-)

Busbar Width

0.036±0.02 mm

Busbar Material

Silver

Anti Reflection Coating

Silicon nitride

Back Surface (+)

Soldering Pad Width

0.036±0.02 mm

Soldering Pad Material

Silver

Electrical Data at STC

Maximum Power (Pmax)

7.794 W

7.825 W

7.861 W

7.894 W

7.925 W

7.958 W

7.991 W

8.024 W

Voltage at Maximum Power Point (Vmpp)

0.583 V

0.603 V

0.591 V

0.597 V

0.6 V

0.593 V

0.595 V

0.596 V

Current at Maximum Power Point (Impp)

13.36 A

12.98 A

13.29 A

13.23 A

13.21 A

13.51 A

13.42 A

13.45 A

Open Circuit Voltage (Voc)

0.709 V

0.704 V

0.706 V

0.705 V

0.705 V

0.692 V

0.691 V

0.697 V

Short Circuit Current (Isc)

14.2 A

14.19 A

14.23 A

14.17 A

14.16 A

14.09 A

14.11 A

14.14 A

Cell Efficiency

23.6 %

23.7 %

23.8 %

23.9 %

24 %

24.1 %

24.2 %

24.3 %

Fill Factor (FF)

77.45 %

78.36 %

78.26 %

78.97 %

79.4 %

81.64 %

82 %

81.44 %

Thermal Ratings

Temperature Coefficient of Pmax

-0.38 %/˚C

Temperature Coefficient of Voc

-0.3 %/˚C

Temperature Coefficient of Isc

0.048 %/˚C

M210-12BB

Product Characteristics

Model No.

9.66

9.70

9.75

9.79

9.83

9.88

9.92

9.97

Product Characteristics

Cell Technology

TOPCon

Dimensions

210×210 mm

Cell Thickness

180 ± 18 µm

Front Surface (-)

No. of Busbars

12

Busbar Width

0.08±0.04 mm

Busbar Material

Silver

Anti Reflection Coating

Silicon nitride

Back Surface (+)

No. of Soldering Pads

12

Soldering Pad Width

2.2±0.4 mm

Soldering Pad Material

Silver

Back Surface Field (BSF)

Aluminium

Electrical Data at STC

Maximum Power (Pmax)

9.66 W

9.7 W

9.75 W

9.79 W

9.83 W

9.88 W

9.92 W

9.97 W

Voltage at Maximum Power Point (Vmpp)

0.571 V

0.572 V

0.572 V

0.572 V

0.573 V

0.573 V

0.574 V

0.576 V

Current at Maximum Power Point (Impp)

16.912 A

16.96 A

17.037 A

17.114 A

17.161 A

17.328 A

17.285 A

17.302 A

Open Circuit Voltage (Voc)

0.667 V

0.667 V

0.668 V

0.668 V

0.669 V

0.672 V

0.673 V

0.675 V

Short Circuit Current (Isc)

17.888 A

17.945 A

17.98 A

18.057 A

18.108 A

18.108 A

18.16 A

18.187 A

Cell Efficiency

21.9 %

22 %

22.1 %

22.2 %

22.3 %

22.4 %

22.5 %

22.6 %

Fill Factor (FF)

80.94 %

81.05 %

81.14 %

81.16 %

81.17 %

81.17 %

81.18 %

81.18 %

Thermal Ratings

Temperature Coefficient of Pmax

-0.38 %/˚C

Temperature Coefficient of Voc

-0.36 %/˚C

Temperature Coefficient of Isc

0.07 %/˚C

182-16BB Bifacial N-Type TOPCon

Product Characteristics

Model No.

7.79

7.82

7.86

7.89

7.92

7.96

7.99

8.02

Product Characteristics

Cell Technology

TOPCon

Dimensions

182×182 mm

Cell Thickness

130 ± 20 µm

Front Surface (-)

Busbar Width

0.035±0.02 mm

Back Surface (+)

Soldering Pad Width

0.035±0.02 mm

Electrical Data at STC

Maximum Power (Pmax)

7.79 W

7.82 W

7.86 W

7.89 W

7.92 W

7.96 W

7.99 W

8.02 W

Voltage at Maximum Power Point (Vmpp)

0.6008 V

0.6016 V

0.6024 V

0.6032 V

0.604 V

0.6054 V

0.6059 V

0.6065 V

Current at Maximum Power Point (Impp)

12.968 A

13.006 A

13.055 A

13.08 A

13.115 A

13.155 A

13.195 A

13.23 A

Open Circuit Voltage (Voc)

0.7012 V

0.7023 V

0.7034 V

0.7042 V

0.705 V

0.7064 V

0.7069 V

0.7075 V

Short Circuit Current (Isc)

13.543 A

13.581 A

13.615 A

13.64 A

13.675 A

13.715 A

13.755 A

13.79 A

Cell Efficiency

23.6-23.7 %

23.7-23.8 %

23.8-23.9 %

23.9-24.0 %

24.0-24.4 %

24.1-24.2 %

24.2-24.3 %

24.3-24.4 %

Fill Factor (FF)

82.04 %

82.03 %

82.12 %

82.14 %

82.17 %

82.2 %

82.22 %

82.24 %

Thermal Ratings

Temperature Coefficient of Pmax

-0.38 %/˚C

Temperature Coefficient of Voc

-0.37 %/˚C

Temperature Coefficient of Isc

0.07 %/˚C

182*210-16BB Bifacial N-Type TOPCon

Product Characteristics

Model No.

9.24

9.28

9.32

9.36

9.39

9.43

9.47

9.51

Product Characteristics

Cell Technology

TOPCon

Dimensions

182×210 mm

Cell Thickness

130 ± 20 µm

Front Surface (-)

Busbar Width

0.035±0.02 mm

Back Surface (+)

Soldering Pad Width

0.035±0.02 mm

Electrical Data at STC

Maximum Power (Pmax)

9.24 W

9.28 W

9.32 W

9.36 W

9.39 W

9.43 W

9.47 W

9.51 W

Voltage at Maximum Power Point (Vmpp)

0.5972 V

0.5996 V

0.6012 V

0.6022 V

0.604 V

0.6051 V

0.606 V

0.6086 V

Current at Maximum Power Point (Impp)

15.473 A

15.474 A

15.498 A

15.536 A

15.552 A

15.588 A

15.627 A

15.622 A

Open Circuit Voltage (Voc)

0.697 V

0.7 V

0.702 V

0.703 V

0.705 V

0.706 V

0.707 V

0.71 V

Short Circuit Current (Isc)

15.734 A

15.727 A

15.742 A

15.779 A

15.794 A

15.832 A

15.869 A

15.861 A

Cell Efficiency

24.2-24.3 %

24.3-24.4 %

24.4-24.5 %

24.5-24.6 %

24.6-24.7 %

24.7-24.8 %

24.8-24.9 %

24.9-25.0 %

Fill Factor (FF)

84.26 %

84.28 %

84.31 %

84.34 %

84.36 %

84.39 %

84.41 %

84.43 %

Thermal Ratings

Temperature Coefficient of Pmax

-0.38 %/˚C

Temperature Coefficient of Voc

-0.36 %/˚C

Temperature Coefficient of Isc

0.07 %/˚C

N-type TOPCon 183.75-10BB

Product Characteristics

Model No.

8

8.03

8.07

8.1

8.13

8.17

8.2

8.23

Product Characteristics

Cell Technology

TOPCon

Dimensions

182×183.75 mm

Diagonal

256±0.5 mm

Cell Thickness

130 ± 13 µm

Front Surface (-)

No. of Busbars

10

Electrical Data at STC

Maximum Power (Pmax)

8 W

8.03 W

8.07 W

8.1 W

8.13 W

8.17 W

8.2 W

8.23 W

Voltage at Maximum Power Point (Vmpp)

0.603 V

0.604 V

0.605 V

0.605 V

0.607 V

0.607 V

0.608 V

0.609 V

Current at Maximum Power Point (Impp)

13.266 A

13.3 A

13.333 A

13.366 A

13.399 A

13.455 A

13.487 A

13.52 A

Open Circuit Voltage (Voc)

0.704 V

0.705 V

0.706 V

0.707 V

0.708 V

0.708 V

0.709 V

0.71 V

Short Circuit Current (Isc)

13.827 A

13.863 A

13.903 A

13.944 A

13.979 A

14.015 A

14.05 A

14.086 A

Cell Efficiency

23.9 %

24 %

24.1 %

24.2 %

24.3 %

24.4 %

24.5 %

24.6 %

Fill Factor (FF)

82.18 %

82.19 %

82.18 %

82.03 %

82.18 %

82.31 %

82.32 %

82.33 %

Thermal Ratings

Temperature Coefficient of Pmax

-0.3 %/˚C

Temperature Coefficient of Voc

-0.25 %/˚C

Temperature Coefficient of Isc

0.045 %/˚C

M10 N183.75-16B-12-BAJ N-type TOPCon

Product Characteristics

Model No.

BAJ-183.75N-242

BAJ-183.75N-243

BAJ-183.75N-244

BAJ-183.75N-245

BAJ-183.75N-246

BAJ-183.75N-247

BAJ-183.75N-248

BAJ-183.75N-249

Product Characteristics

Cell Technology

TOPCon

Dimensions

182×183.75 mm

Diagonal

256±0.5 mm

Cell Thickness

130 ± 13 µm

Electrical Data at STC

Maximum Power (Pmax)

8.1 W

8.134 W

8.167 W

8.201 W

8.234 W

8.267 W

8.301 W

8.334 W

Voltage at Maximum Power Point (Vmpp)

0.629 V

0.631 V

0.632 V

0.633 V

0.635 V

0.636 V

0.637 V

0.639 V

Current at Maximum Power Point (Impp)

12.872 A

12.897 A

12.922 A

12.948 A

12.973 A

12.998 A

13.024 A

13.049 A

Open Circuit Voltage (Voc)

0.727 V

0.728 V

0.729 V

0.729 V

0.73 V

0.731 V

0.732 V

0.733 V

Short Circuit Current (Isc)

13.744 A

13.761 A

13.778 A

13.795 A

13.812 A

13.829 A

13.846 A

13.868 A

Cell Efficiency

24.2 %

24.3 %

24.4 %

24.5 %

24.6 %

24.7 %

24.8 %

24.9 %

Fill Factor (FF)

81.07 %

81.21 %

81.36 %

81.5 %

81.64 %

81.78 %

81.93 %

82.04 %

Thermal Ratings

Temperature Coefficient of Pmax

-0.29 %/˚C

Temperature Coefficient of Voc

-0.26 %/˚C

Temperature Coefficient of Isc

0.046 %/˚C